FF55MR12W1M1HB11BPSA1
EASYDUAL MODULE WITH COOLSIC TRE
FF55MR12W1M1HB11BPSA1 Specifications
Part Status：
Active
Mounting Type：
Chassis Mount
Supplier Device Package：
-
Grade：
-
Qualification：
-
Package / Case：
Module
Power - Max：
-
Operating Temperature：
-40°C ~ 175°C (TJ)
Configuration：
2 N-Channel (Half Bridge)
Technology：
Silicon Carbide (SiC)
Current - Continuous Drain (Id) @ 25°C：
15A (Tj)
Vgs(th) (Max) @ Id：
5.15V @ 6mA
Gate Charge (Qg) (Max) @ Vgs：
45nC @ 18V
Input Capacitance (Ciss) (Max) @ Vds：
1350pF @ 800V
FET Feature：
Silicon Carbide (SiC)
